XG6-Serie

Client-SSD


Die XG6-Serie setzt auf den neuesten 96-Layer-3-D-TLC-Flashspeicher (3 Bit pro Zelle) von KIOXIA. Mit „BiCS FLASH™“-Speicher der vierten Generation und SLC-Cache-Features erreichen XG6-SSDs sequenzielle Lese- und Schreibgeschwindigkeiten von bis zu 3.180 MB/s bzw. 2.960 MB/s. Sie bieten darüber hinaus bis zu 355.000 IOPS beim zufälligen Lesen und 365.000 IOPS beim zufälligen Schreiben. Neben ihrer hohen Performance übernimmt die XG6-Serie auch das Low-Power-Design der XG-Produktfamilie: Sie verbraucht im aktiven Modus 4,7 W oder weniger und im Stand-by-Modus nicht einmal 3 mW.
Die neue XG6-Serie ist für stromsparende Mobile-PCs, leistungsorientierte Gaming-PCs sowie für Serverboot, Caching und Logging in Rechenzentrenumgebungen optimiert.
Die XG6-Serie ist im kompakten M.2-2280-Formfaktor (single-sided) und in drei Kapazitäten (256/512/1.024 GB) erhältlich. Für jedes Modell ist optional eine Version mit „Self-Encrypting Drive“ (SED) inklusive Unterstützung für TCG Opal Version 2.01 verfügbar.

Hauptmerkmale
  • 96-Layer BiCS FLASH™ von KIOXIA
  • PCIe® Gen3 x4, NVMe™
  • Kapazitäten von bis zu 1.024 GB
  • M.2 2280 Single-sided
  • TCG OPAL 2.01 optional für SED
Anwendungen
  • Leistungsstarke, dünne Notebook-PCs
  • High-Performance-Desktop-PCs
  • Gaming-PCs
  • Serverboot, Caching und Logging im Rechenzentrum

Dokumente

Spezifikationen

Model Number(Non-SED)KXG60ZNV1T02KXG60ZNV512GKXG60ZNV256G
Model Number(SED)KXG6AZNV1T02KXG6AZNV512GKXG6AZNV256G
Capacity1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2280-S2 Single-sided
Connector TypeM.2 M
lnterfacePCIe® Gen3 x4, NVMe™ 1.3a
lnterface Speed32 GT/s (Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read3,180 MB/s3,100 MB/s3,050 MB/s
Sequential Write2,960 MB/s2,800 MB/s1,550 MB/s
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.7 W typ.4.1 W typ.4 W typ.
Power Consumption (L1.2 mode)3 mW typ.
Reliability
MTTF1,500,000 hours
Dimensions
Height2.23 mm
Width22.0 mm
length80.0 mm typ.
Weight7.3 g typ.7.0 g typ.
Environmental
Temperature (Operating)0 ~ 95 °C (Controller Temperature)
Temperature (Operating)0 ~ 85 °C (Other Components Temperature)
Temperature(Non-operating)-40 ~ 85 °C
Vibration (Operating/Non-operating)196 m/s2 { 20 G } ( Peak, 10 ~ 2,000 Hz )
Shock (Operating/Non-operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features・Sanitize command is supported.
・Namespace Management and Namespace Attachment commands are supported.
・Non-Operational Power State Configuration is supported.
・TCG Storage Interface Interactions Specification (SIIS) Version 1.07 is supported.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of their respective companies.