XFMEXPRESS™ Memory Device is characterized by small-thin removable form factor and easy-to-implement via PCI Express® (PCIe®) interface and NVM Express™ (NVMe™) protocol.


Technology of XFMEXPRESS™


XFMEXPRESS™ is a new small-thin removable form factor memory technology with PCI Express® (PCIe®) Interface and NVM Express™ ( NVMe™ ) protocol. It has an easy-to-implement capability with an innovative connector combination. The XFMEXPRESS™ is for embedded and removable memory device designed to be used for ultra-mobile PCs, IoT devices and various embedded applications.

What is the size of XFMEXPRESS™ Memory Device?

XFMEXPRESS™’s size (14mm x 18mm x 1.4mm) offers a 252mm2 footprint designated for ultra-compact host devices.

How did you design the form factor specification of this device?

XFMEXPRESS™ adopts the size that current and future 3D flash memory can stack.

Do you have any plan to develop XFMEXPRESS™ to be compatible with new protocol, like PCIe® Gen.4?

Yes. We plan to develop XFMEXPRESS™ reflecting new protocol, like PCIe® Gen.4.

How many lanes can be deployed in the future XFMEXPRESS™?

Currently XFMEXPRESS™ supports interface scalability with a base 1-lane or 2-lane PCIe® interface.

Other Questions

How can I get more information on XFMEXPRESS™?

Please contact KIOXIA Corporation at ytc-mb-XFMEXPRESS@kioxia.com.

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