UFS/e-MMC for Automotive

Diagram showing automotive functions that need flash storage

Automotive UFS(5)

Image of KIOXIA automotive UFS

Our broad density lineup of high-speed UFS memory for automotive applications is perfectly positioned to support the data storage demands of increasingly complex automotive applications.
KIOXIA Automotive UFS supports a temperature range (-40°C to +105°C), meets AEC-Q100 Grade 2(7) requirements and offers the extended reliability required by various automotive applications. Available capacities include 16GB, 32GB, 64GB, 128GB, 256GB and 512GB.

Automotive e-MMC(6)

Image of KIOXIA automotive eMMC

As with KIOXIA’s Automotive UFS, our Automotive e-MMC supports a temperature rage (-40°C to +105°C), meets AEC-Q100 Grade 2(7) requirements, and features the enhanced reliability that automotive applications demand.

Changing Lanes

UFS was specifically developed to be the high-performance replacement to e-MMC. It has become the dominant solution for smartphones and continues to migrate into automotive and other applications. UFS will ultimately surpass e-MMC as the dominant storage solution for automotive applications.

Graph showing automotive storage trend among eMMC, UFS, eMCP, uMCP, and SD card

Why UFS?

Simply put – it’s the successor to e-MMC. UFS performance will continue to advance, widening the already significant performance advantage it has over e-MMC.

When compared to e-MMC, UFS delivers:

  • A faster interface
  • Higher performance for reads and writes
  • Higher density offerings
  • Better power efficiency
  • Support for full duplexing
Graph showing boot time comparison among UFS, eMMC and QSPI NOR

Additional Features well-suited for Automotive Reliability

  • Thermal Control: If the device exceeds 105°C, the device notifies the host processor to take action
  • Extended Diagnosis: UFS controller monitors various items such as w/e cycles, current temperature, etc. and reports device status to the host processor
  • Longevity Support: UFS is now the main storage for the large mobile market, and is being adopted by automotive

Auto Requirements

  • Meets Automotive standards (e.g., AEC-Q100 Stress Test Qual Standard)
  • Supports PPAP (to ensure consistent production of quality parts)
  • Extended Temperature Range (e.g., -40°C to +105°C)
  • Low Failure Rate
  • Extended Product Change Notices (PCNs)
  • Longevity Support
  • Features for Automotive (e.g., enhanced solder ball reliability, countermeasures if chip exceeds certain temp, etc.)

 

KIOXIA has led the way in UFS since 2013, when we were the first to sample the technology, and will continue to pave the road forward for the automotive applications of the future.

Why Data Retention is Becoming More Critical in Automotive Applications (PDF : 1.2MB)

White Paper

Driving the Future of Automotive Applications (PDF : 1MB)

Infographic

KIOXIA Automotive Managed Flash Solutions (PDF : 675KB)

Product Brief

Automotive UFS

AEC-Q100 Grade2
Capacity Part Number UFS
version		 Max Data Rate
(MB/s)		 Supply Voltage Operating Temperature
(℃)		 Package Size
(mm)
VCC
(V)		 VCCQ
(V)		 VCCQ2
(V)
16GB THGAF9G7L1LBAB7 (2) 2.1 1166 2.7 to 3.6 - (4) 1.70 to 1.95 -40 to 105 (1) 11.5x13.0x1.0
32GB THGAFBG8T13BAB7
THGAFEG8T13BAB7 (2)
64GB THGAFBG9T23BAB8 11.5x13.0x1.2
THGAFEG9T23BAB8 (2)
128GB THGAFBT0T43BAB8
THGAFET0T43BAB8 (2)
256GB THGAFBT1T83BAB5 11.5x13.0x1.3
THGAFET1T83BAB5 (2)
512GB THGAFBT2T83BABI (3) 14.0x18.0x1.2

Automotive e-MMC

AEC-Q100 Grade2
Capacity Part Number e-MMC
version		 Max Data Rate
(MB/s)		 Supply Voltage Operating Temperature
(℃)		 Package Size
(mm)
VCC[V] VCCQ[V]
8GB THGBMJG6C1LBAB7 5.1 400 2.7 to 3.6 1.70 to 1.95,
2.7 to 3.6		 -40 to 105 (1) 11.5x13.0x1.0
16GB THGBMJG7C2LBAB8 11.5x13.0x1.2
32GB THGBMJG8C4LBAB8
64GB THGBMJG9C8LBAB8

Note (1): Tc=115℃ max.

Note (2) : Maximum pre-load capacity is 100% of the user area capacity.

Note (3) : New product. Sample specifications may differ from mass production parts.

Note (4) : This product supports dual-supply operation at VCC and VCCQ2. VCCQ need not be supplied.

Note (5): Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.

Note (6): e-MMC is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification.

Note (7): Electrical component qualification requirements defined by the AEC (Automotive Electronics Council).

 

  • Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications. The definition of 1GB = 230 bytes = 1,073,741,824 bytes.
  • Company names, product names, and service names may be trademarks of their respective companies.

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