XFMEXPRESS Memory Device is characterized by small-thin removable form factor and easy-to-implement via PCI Express® (PCIe®) interface and NVM Express™ (NVMe™) protocol.


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Technology of XFMEXPRESS


XFMEXPRESS is a new small-thin removable form factor memory technology with PCI Express® (PCIe®) Interface and NVM Express™ (NVMe™) protocol. It has an easy-to-implement capability with an innovative connector combination. The XFMEXPRESS is for embedded and removable memory device or removable SSD designed to be used for ultra-mobile PCs, IoT devices and various embedded applications.

What is the size of XFMEXPRESS Memory Device?

The size (14mm x 18mm x 1.4mm) of XFMEXPRESS offers a 252mm2 footprint designated for ultra-compact host devices.

How did you design the form factor specification of this device?

XFMEXPRESS adopts the size that current and future 3D flash memory can stack.

Do you have any plan to develop XFMEXPRESS to be compatible with new protocol, like PCIe® Gen.4?

Yes. We plan to develop XFMEXPRESS reflecting new protocol, like PCIe® Gen.4 and 5.

How many lanes can be deployed in the future XFMEXPRESS?

Currently XFMEXPRESS supports interface scalability with a base 1-lane or 2-lane PCIe® interface, along with an optional 4-lane PCIe® interface.

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