Automotive Managed Flash Solutions

Automotive UFS

Our broad density lineup of high-speed UFS memory for automotive applications is perfectly positioned to support the data storage demands of increasingly complex automotive applications.

KIOXIA Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade 2 requirements and offers the extended reliability required by various automotive applications. Available capacities include 16GB, 32GB, 64GB, 128GB, 256GB and 512GB.

Automotive e-MMC

As with KIOXIA’s Automotive UFS, our Automotive e-MMC supports a wide temperature rage (up to 105°C), meets AEC-Q100 Grade 2 requirements, and features the enhanced reliability that automotive applications demand.

Changing Lanes

UFS was specifically developed to be the high-performance replacement to e-MMC. Market demand for UFS will eventually surpass e-MMC, though e-MMC will continue to be an option for applications requiring lower densities.

  • UFS is the faster performance JEDEC standard replacement to e-MMC
  • UFS is replacing e-MMC in Smartphones and other markets and migrating into Automotive

Why UFS?

Simply put – it’s the ideal successor to e-MMC. UFS performance will continue to advance, widening the already significant performance advantage it has over e-MMC.

When compared to e-MMC, UFS delivers:

  • A faster interface
  • Higher performance for reads and writes
  • Higher density offerings
  • Better power efficiency
  • Support for full duplexing

Additional Features well-suited for Automotive Reliability

  • Thermal Control: If the device exceeds 105C, the device notifies the host processor to take action
  • Extended Diagnosis: UFS controller monitors various items such as w/e cycles, current temperature, etc. and reports device status to the host processor
  • Better long term support in the market: UFS is now the main storage for the large mobile market, as is being adopted by automotive

Auto Requirements

  • Meets Automotive standards (e.g., AEC-Q100 Stress Test Qual Standard)
  • Supports PPAP (to ensure consistent production of quality parts)
  • Extended Temperature Range (e.g., -40C to +105C)
  • Low Failure Rate
  • Extended PCNs
  • Longevity of Support
  • Features ideal for Automotive (e.g., enhanced solder ball reliability, countermeasures if chip exceeds certain temp, etc.)

KIOXIA has led the way in UFS since 2013, when we were the first to sample the technology, and will continue to pave the road forward for the automotive applications of the future.

Automotive e-MMC

AEC-Q100 Grade2
Capacity Part Number e-MMC
version
Max Data Rate
(MB/s)
Supply Voltage Operating Temperature
(℃)
Package Size
(mm)
VCC[V] VCCQ[V]
8GB THGBMJG6C1LBAB7 5.1 400 2.7 to 3.6 1.70 to 1.95,
2.7 to 3.6
-40 to 105 (1) 11.5x13.0x1.0
16GB THGBMJG7C2LBAB8 11.5x13.0x1.2
32GB THGBMJG8C4LBAB8
64GB THGBMJG9C8LBAB8

Automotive UFS

AEC-Q100 Grade2
Capacity Part Number UFS
version
Max Data Rate
(MB/s)
Supply Voltage Operating Temperature
(℃)
Package Size
(mm)
VCC
(V)
VCCQ
(V)
VCCQ2
(V)
16GB THGAF9G7L1LBAB7 (2) 2.1 1166 2.7 to 3.6 - (4) 1.70 to 1.95 -40 to 105 (1) 11.5x13.0x1.0
32GB THGAFBG8T13BAB7
THGAFEG8T13BAB7 (2)
64GB THGAFBG9T23BAB8 11.5x13.0x1.2
THGAFEG9T23BAB8 (2)
128GB THGAFBT0T43BAB8
THGAFET0T43BAB8 (2)
256GB THGAFBT1T83BAB5 11.5x13.0x1.3
THGAFET1T83BAB5 (2)
512GB THGAFBT2T83BABI (3) 14.0x18.0x1.2

Note (1): Tc=115℃ max.

Note (2) : Maximum pre-load capacity is 100% of the user area capacity.

Note (3) : New product. Sample specifications may differ from mass production parts.

Note (4) : This product supports dual-supply operation at VCC and VCCQ2. VCCQ need not be supplied.

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