Immagine di xg6_001

Client NVMe™ SSD 

KIOXIA la serie XG6 utilizza la più recente memoria flash KIOXIA a 96 livelli, TLC 3D (3 bit per cella). Con le funzionalità cache BiCS FLASH™ e SLC di quarta generazione, gli SSD XG6 raggiungono velocità di lettura/scrittura sequenziali rispettivamente di 3180 MB/s e 2960 MB/s e forniscono fino a 355.000 IOPS in lettura casuale e 365.000 in scrittura casuale. Oltre alle alte prestazioni, XG6 mantiene il design a bassa potenza della famiglia XG, con un consumo di 4,7 W o inferiore in modalità attiva e inferiore a 3 mW in modalità stand-by.

La nuova serie XG6 è ottimizzata per PC mobili sensibili all'alimentazione, PC gaming orientati alle prestazioni e ambienti di data center per avvio server, caching e registrazione.
Disponibile in un fattore di forma a lato singolo compatto M.2 2280, la serie XG6 è disponibile in tre modelli con capacità da 256 GB, 512 GB e 1024 GB, ciascuno con l'opzione di un modello di unità SED (Auto-Encrypting Drive) che supporta TCG Opal Versione 2.01.

Documenti

Caratteristiche principali

  • KIOXIA BiCS FLASH™ a 96 strati
  • PCIe® Gen3 x4, NVMe™
  • Capacità fino a 1.024 GB
  • M.2 2280 a lato singolo
  • TCG Opal 2.01 Opzionale per SED

Applicazioni principali

  • PC notebook sottili e performanti
  • PC desktop ad alte prestazioni
  • PC gaming
  • Utilizzo della registrazione di caching e avvio server nel data center

Specifiche

* Table can be scrolled horizontally.

Base Model NumberKXG60ZNV1T02KXG60ZNV512GKXG60ZNV256G
SED Model NumberKXG6AZNV1T02KXG6AZNV512GKXG6AZNV256G
Capacity1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2280-S2 Single-sided
lnterfacePCIe® 3.0, NVMe™ 1.3a
Maximum Interface Speed32 GT/s (PCIe® Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read3,180 MB/s3,100 MB/s3,050 MB/s
Sequential Write2,960 MB/s2,800 MB/s1,550 MB/s
Random Read355K IOPS325K IOPS270K IOPS
Random Write365K IOPS355K IOPS335K IOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.7 W typ.4.1 W typ.4.0 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF1,500,000 hours
TBW600300150
Dimensions
Thickness2.23 mm Max
Width22.0 mm ± 0.15 mm
Length80.0 mm ± 0.15 mm
Weight7.3 g Max7.0 g Max
Environmental
Temperature (Operating)0 ℃ to 95 ℃ (Controller Temperature)
Temperature (Operating)0 ℃ to 85 ℃ (Other Components Temperature)
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 Hz to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.

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