Image of xg6-p_001

SSD NVMe™ de cliente

Ao se beneficiar do TLC 3D BiCS FLASH™ de 96 camadas da KIOXIA Corporation (3 bits por célula), os SSDs XG6-P fornecem alta capacidade de armazenamento, mantendo uma eficiência energética excepcional, alta velocidade, tudo em um design ultrafino.

A linha XG6-P é a mais apropriada para produção de conteúdo de vídeo/CG que exige acesso de alta velocidade a dados de alta capacidade, aplicativos com aprendizado de máquina e IA, estações de trabalho e PCs de última geração.

A série XG6-P atinge 2.920MB/s de desempenho de gravação sequencial, o que representa uma melhoria de 32,7% em relação ao modelo premium da geração anterior XG5-P.

O SSD XG6-P de 2.048GB está disponível em formato único M.2 2280 (22 x 80mm) e oferece opções de segurança, incluindo suporte ao TCG Pyrite, versão 1.0, para configurações sem SED (Self-Encrypting Drive) e o TCG Opal, versão 2.01, com suporte para SED.

Documentos

Principais recursos

  • BiCS FLASH™ de 96 camadas da KIOXIA
  • PCIe® Gen3 x4 de 96 camadas da KIOXIA, NVMe™
  • Capacidade de até 2.048 GB
  • M.2 2280 (de lado único)
  • TCG OPAL 2.01 opcional para SED

Principais aplicações

  • Estações de trabalho
  • PCs de alta tecnologias
  • Produção de conteúdo em vídeo e CG
  • Aprendizado de máquina e IA

Especificações

* Table can be scrolled horizontally.

Base Model NumberKXG60PNV2T04
SED Model NumberKXG6APNV2T04
Capacity2,048 GB
Basic Specifications
Form FactorM.2 2280-S2 Single-sided
lnterfacePCIe® 3.0, NVMe™ 1.3a
Maximum Interface Speed32 GT/s (PCIe® Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read3,180 MB/s
Sequential Write2,920 MB/s
Random Read355K IOPS
Random Write365K IOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.9 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF1,500,000 hours
TBW600
Dimensions
Thickness2.23 mm Max
Width22.0 mm ± 0.15 mm
Length80.0 mm ± 0.15 mm
Weight7.3 g Max
Environmental
Temperature (Operating)0 ℃ to 95 ℃ (Controller Temperature)
Temperature (Operating)0 ℃ to 85 ℃ (Other Components Temperature)
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 Hz to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.

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