BG4 Series

Client SSD

The BG4 series is a line-up of compact single package NVMe™ SSDs with capacities up to 1,024GB, and leverages a PCIe® Gen3 x4 interface and KIOXIA's 96-layer TLC BiCS FLASH™. With higher bandwidth and improved flash management and Host Memory Buffer (HMB) technology, BG4 SSDs deliver best-in-class read performance in single package SSDs, of up to 2,300MB/s (sequential read) and up to 390K IOPS (random read), with active power consumption of up to 3.7W (Typ.).

The BG4 series is available in four capacities of 128GB, 256GB, 512GB and 1,024GB in surface-mount M.2 1620 single package or removable M.2 2230 module form factor options, making them suitable for thin and light system designs for ultra-thin PCs, as well as embedded devices and server boot in data centers.

The BG4 series is with the option of a Self-Encrypting Drive (SED) model supporting TCG Opal Version 2.01.


Key Features
  • KIOXIA's 96-layer BiCS FLASH™
  • PCIe® Gen3 x4, NVMe™
  • Capacities up to 1,024GB
  • M.2 1620 single package and M.2 2230 single-sided form factor
  • TCG OPAL 2.01 Optional for SED
  • Ultra-mobile PCs
  • 2-in-1 notebook PCs
  • IoT/embedded devices
  • Server and storage array boot drives


Product Video


  M.2 1620-S3 Single package M.2 1620-S2
Single package
M.2 2230-S3
Single-sided Module
M.2 2230-S2
Single-sided Module
Basic Specifications (Non SED models)
Model Number KBG40ZPZ1T02 KBG40ZPZ512G KBG40ZPZ256G KBG40ZPZ128G KBG40ZNS1T02 KBG40ZNS512G KBG40ZNS256G KBG40ZNS128G
Capacity 1,024 GB 512 GB 256 GB 128 GB 1,024 GB 512 GB 256 GB 128 GB
Connector Type - M.2 M
Interface PCIe® Gen3 x4, NVMe™ 1.3b
Maximum Interface Speed 32 GT/s
(PCIe® Gen3 x4)
Flash Memory Type BiCS FLASH™ TLC
Sequential Read (Up to) 2,300 MB/s 2,200 MB/s 2,000 MB/s 2,300 MB/s 2,200 MB/s 2,000 MB/s

Sequential Write (Up to)

1,800 MB/s 1,400 MB/s 800 MB/s 1,800 MB/s 1,400 MB/s 800 MB/s
Random Read (Up to) 390,000 IOPS 330,000 IOPS 200,000 IOPS 390,000 IOPS 330,000 IOPS 200,000 IOPS
Random Write (Up to) 200,000 IOPS 190,000 IOPS 150,000 IOPS 200,000 IOPS 190,000 IOPS 150,000 IOPS
MTTF 1,500,000 hours
Power Requirements
Supply Voltage 3.3 V ±5 %
1.8 V ±5 %
1.2 V ±5 %
3.3 V ±5 %
Power consumption (Active) 3.4 W typ. 3.1 W typ. 3.2 W typ. 3.0 W typ. 3.7 W typ. 3.5 W typ. 3.6 W typ. 3.4 W typ.
Power consumption (L1.2 mode) 5 mW typ. 5 mW typ.
Height 1.50 mm Max. 1.30 mm Max. 2.38 mm Max. 2.23 mm Max.
Width 16.00 mm 22.00 mm
Length 20.00 mm 30.00 mm
Weight 1.00 g typ. 0.85 g typ. 2.6 g typ. 2.5 g typ.
Temperature (Operating) 0 to 85 °C (TSMART) 0 to 85 °C (TSMART)
Temperature (Non-operating) -40 to 85 °C
Vibration (Operating/Non-operating) - 196 m/s2 { 20 G } ( Peak, 10 ~ 2,000 Hz )
Shock (Operating/Non-operating) - 14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features
  • Host Memory Buffer feature is supported.
  • SLC cache is supported.
  • Sanitize command is supported.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes.  A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity.  Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content.  Actual formatted capacity may vary.
  • 1 MB (megabyte) = 1,000,000 bytes.
  • IOPS: Input Output Per Second (or the number of I/O operations per second)
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation.  Actual operating life of the product may be different from the MTTF.
  • TSMART: Composite Temperature in SMART/Health Information
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a trademark of NVM Express, Inc.
  • All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.
  • All information provided here is subject to change without prior notice.