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Твердотельные накопители NVMe™ для центров обработки данных

SSD накопители E1.S XD6-серии от KIOXIA разработаны в соответствии со спецификацией форм-фактора Enterprise and Datacenter SSD Form Factor (EDSFF) E1.S для удовлетворения конкретных требований гипермасштабируемых приложений, включая требования к производительности, мощности и температурному режиму, предъявляемые в соответствии со спецификацией Open Compute Project (OCP) NVMe™ Cloud SSD.  Разработанные для оптимизации плотности и эффективности системы, твердотельные накопители серии XD6 представляют собой будущее флэш-памяти для серверов и систем хранения в облачных и гипермасштабируемых центрах обработки данных.

Документы

Ключевые особенности

  • Соответствует спецификациям PCIe® 4.0, NVMe™ 1.3c
  • Форм-фактор E1.S, толщина 9,5 мм
  • Собственная архитектура KIOXIA: контроллер, встроенное ПО и 3D флэш-память BiCS FLASH™
  • Варианты емкости 1,92 ТБ / 3,84 ТБ
  • Защита от потери питания (PLP) и сквозная защита данных
  • Возможность обеспечения безопасности: SED (TCG-Opal 2.0)

Ключевые области применения

  • Серверы и системы хранения для облачных и гипермасштабируемых центров обработки данных

Характеристики

* Table can be scrolled horizontally.

SED Model NumberKXD6CRJJ3T84KXD6CRJJ1T92
Capacity3,840 GB1,920 GB
Basic Specifications
Form FactorE1.S
lnterfacePCIe® 4.0, NVMe™ 1.3c
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sustained 128 KiB Sequential Read6,500 MB/s
Sustained 128 KiB Sequential Write2,350 MB/s1,200 MB/s
Sustained 4 KiB Random Read880K IOPS660K IOPS
Sustained 4 KiB Random Write90K IOPS50K IOPS
Power Requirements
Supply Voltage12 V ± 10 %
Power Consumption (Active)14 W typ.12 W typ.
Power Consumption (Ready)5 W typ.
Reliability
MTTF2,000,000 hours
DWPD1
Dimensions
Thickness9.5 mm ± 0.35 mm
Width33.75 mm ± 0.25 mm
Length118.75 mm ± 0.55 mm
Weight75 g Max
Environmental
Temperature (Operating)0 °C to 70 °C
Temperature (Non-operating)-40 °C to 85 °C
Humidity (Operating)5 % to 95 % R.H.
Vibration (Operating)21 m/s2 { 2.17 Grms } ( 7 Hz to 800 Hz )
Shock (Operating)9.8 km/s2 { 1,000 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • GT/s: Giga Transfers per second.
  • A kibibyte (KiB) means 2^10, or 1,024 bytes.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • DWPD: Drive Writes Per Day. One full drive write per day means the drive can be written and re-written to full capacity once a day every day for the specified lifetime. Actual results may vary due to system configuration, usage and other factors.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • SED optional model supports TCG Opal SSC except for some features. For more details, please make inquiries through “Contact us”.
  • SED optional model is not available in all countries due to export and local regulations.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.

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