BG3系列

客戶級SSD


BG3 系列採用 64 層、每單元 3 位元 (TLC) 的 BiCS FLASH™,並具備 NVMe™ Revision 1.2.1。本系列 SSD 產品搭載主機記憶體緩衝區 (HMB) 技術,可在無 DRAM 架構中維持高效能,同時降低功率並縮減尺寸。

 

BG3 SSD 是創新的次世代單一封裝球柵陣列 (BGA) SSD 產品系列,可發揮系統設計靈活性,使行動運算及物聯網嵌入式裝置更輕薄短小、快速,並提升能源效率。另外,對於資料中心應用而言,這些節能 BG3 SSD 可做為伺服器驅動型儲存裝置的替代方案。

 

BG3 系列提供 128GB、256GB 及 512GB 容量。以上三種機型皆可選擇表面黏著單一封裝 M.2 1620 或可拆卸模組 M.2 2230 外型規格。另外亦提供 BG3 SED 機型。

產品特色
  • KIOXIA 64-層 BiCS FLASH™
  • PCIe® Gen3 x2, NVMe™
  • 容量高達512GB
  • M.2 1620 單一封裝及 M.2 2230 單面外型規格
  • SED 型號可選用TCG OPAL 2.01
主要應用
  • 超級行動電腦(Ultra-mobile PCs)
  • 二合一筆記型電腦
  • 物聯網嵌入式裝置
  • 伺服器/儲存裝置開機

文件

產品規格

  M.2 1620-S3
Single Package
M.2 1620-S2
Single Package
M.2 2230-S3
Single-sided Module
M.2 2230-S2
Single-sided Module
Basic Specifications
Model Number (Non-SED) KBG30ZPZ512G KBG30ZPZ256G KBG30ZPZ128G KBG30ZMS512G KBG30ZMS256G KBG30ZMS128G
(SED) KBG3AZPZ512G KBG3AZPZ256G KBG3AZPZ128G KBG3AZMS512G KBG3AZMS256G KBG3AZMS128G
Formatted Capacity 512 GB 256 GB 128 GB 512 GB 256 GB 128 GB
Connector Type - M.2 B-M
Interface PCIe® Gen3 x2, NVMe™ 1.2.1
Maximum Interface Speed 16 GT/s
(PCIe® Gen3 x2)
Flash Memory Type TLC (BiCS FLASH™)
Sequential Read
(Up to)
(Non-SED) 1,500 MB/s
{1,430 MiB/s}
1,400 MB/s
{1,330 MiB/s}
1,300 MB/s
{1,240 MiB/s}
1,500 MB/s
{1,430 MiB/s}
1,400 MB/s
{1,330 MiB/s}
1,300 MB/s
{1,240 MiB/s}
(SED) 1,300 MB/s
{1,240 MiB/s}
1,250 MB/s
{1,190 MiB/s}
1,200 MB/s
{1,140 MiB/s}
1,300 MB/s
{1,240 MiB/s}
1,250 MB/s
{1,190 MiB/s}
1,200 MB/s
{1,140 MiB/s}
Sequential Write
(Up to)
(Non-SED) 1,000 MB/s
{950 MiB/s}
800 MB/s
{760 MiB/s}
600 MB/s
{570 MiB/s}
1,000 MB/s
{950 MiB/s}
800 MB/s
{760 MiB/s}
600 MB/s
{570 MiB/s}
(SED) 950 MB/s
{900 MiB/s}
750 MB/s
{710 MiB/s}
550 MB/s
{520 MiB/s}
950 MB/s
{900 MiB/s}
750 MB/s
{710 MiB/s}
550 MB/s
{520 MiB/s}
Reliability
MTTF 1,500,000 hours
Power Requirements
Supply Voltage 3.3 V ±5 %
1.8 V ±5 %
1.2 V ±5 %
3.3 V ±5 %
Power consumption (Active) 2.8 W typ. 2.7 W typ. 3.3 W typ. 3.2 W typ.
Power consumption (L1.2 mode) 5 mW max. 5 mW max.
Dimensions
Height 1.5 mm 1.3 mm 2.38 mm 2.18 mm
Width 16.0 mm 22.0 mm
Length 20.0 mm 30.0 mm
Weight 1.00 g typ. 0.85 g typ. 2.60 g typ. 2.42 g typ.
Environmental
Temperature (Operating) 0 to 80 °C (Package Temperature) 0 to 80 °C (Components Temperature)
Temperature (Non-operating) -40 to 85 °C
Vibration
(Operating/Non-operating)
- 196 m/s2 { 20 G } ( Peak, 10 ~ 2,000 Hz )
Shock
(Operating/Non-operating)
- 14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features
  • Device Self-test is supported.
  • Host Controlled Thermal Management (HCTM) is supported.
  • The feature of Host Memory Buffer (HMB) is supported.
  • Firmware security feature (only digitally signed firmware can be installed) is supported.
  • For additional information, please refer to BG3 Series Product Brief.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes.  A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity.  Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content.  Actual formatted capacity may vary.
  • A kibibyte (KiB) means 210, or 1,024 bytes, a mebibyte (MiB) means 220, or 1,048,576 bytes, and a gibibyte (GiB) means 230, or 1,073,741,824 bytes.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation.  Actual operating life of the product may be different from the MTTF.
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a trademark of NVM Express, Inc.
  • All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.